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| ILX734LA 10500 x 3 pixel CCD Linear Sensor (Color) For the availability of this product, please contact the sales office. Description The ILX734LA is a reduction type CCD linear sensor developped for color image scanner, and has shutter function per each color. This sensor reads A4-size documents at a density of 1200 DPI. Features * Number of effective pixels: 31500 pixels (10500 pixels x 3) * Pixel size: 8m x 8m (8m pitch) * Distance between line: 64m (8 lines) * Single-sided readout * Shutter function * Ultra low lag/High sensitivity * Single 12V power supply * Input Clock Pulse: CMOS 5V drive * Number of output 3 (R, G, B) * Package: 56 pin SDIP (400 mil) Absolute Maximum Ratings * Supply voltage VDD 15 * Operating temperature -10 to +55 * Storage temperature -30 to +80 Pin Configuration (Top View) 56 pin SDIP (Cer-DIP) Block Diagram 33 SHUT 24 SHUT 22 SHUT ROG-B ROG-G Driver Driver Driver Driver Driver V C C 34 2 VDD 35 Shutter Gate Driver 23 Shutter Gate Shutter Gate 1 1 1 VOUT-R GND RS LH GND 1 2 3 4 5 6 G 7 R B 55 VOUT-G Read Out Gate Read Out Gate Green Blue Red 54 VOUT-B 53 VDD Shutter Drain Shutter Drain CCD Register CCD Register Shutter Drain 51 NC 50 2 50 2 CCD Register 52 NC Read Out Gate SHUT-R 22 1 23 SHUT-G 24 ROG-R 25 GND 26 10500 10500 10500 NC 27 NC 28 35 VDD LH 34 2 33 SHUT-B 32 ROG-B 31 ROG-G 30 NC 5 VOUT-B 54 VOUT-G 55 29 NC Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- VOUT-R 2 E99216-PS GND 3 RS VDD 53 4 GND 6 1 7 S10500 D63 S1 D14 D15 D64 S10500 D63 S1 D14 D15 D64 S10500 D63 S1 D14 D15 D64 NC 1 56 NC 1 ROG-R 32 25 D83 D83 D83 GND 31 26 ILX734LA Pin Description (Pins other than below are defined as NC.) Pin No. 1 2 3 4 5 6 7 22 23 24 25 26 Symbol NC VOUT-R GND RS LH GND 1 SHUT-R 1 SHUT-G ROG-R GND NC Signal out (red) GND Clock pulse input Clock pulse input GND Clock pulse input Clock pulse input Clock pulse input Clock pulse input Clock pulse input GND Description Pin No. 31 32 33 34 35 50 51 52 53 54 55 56 Symbol ROG-G ROG-B SHUT-B 2 VDD 2 NC NC VDD VOUT-B VOUT-G NC Description Clock pulse input Clock pulse input Clock pulse input Clock pulse input 12V power supply Clock pulse input NC NC 12V power supply Signal out (blue) Signal out (green) NC Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12 Max. 12.6 Unit V Clock Characteristics Item Input capacity of 1, 2 Input capacity of LH Input capacity of RS C1, C2 CLH CRS Symbol Min. -- -- -- -- Typ. 1600 10 10 10 Max. -- -- -- -- Unit pF pF pF pF Input capacity of ROG, SHUT1 CROG, CSHUT 1 It indicates that ROG-R, ROG-G, ROG-B as ROG, SHUT-R, SHUT-G, SHUT-B as SHUT. Clock Frequency Item 1, 2, LH, RS Symbol f1, f2, fLH, fRS Min. -- Typ. 1 Max. 5 Unit MHz Input Clock Pulse Voltage Condition Item 1, 2, LH, RS, ROG, SHUT pulse voltage High level Low level Min. 4.75 -- Typ. 5.0 0 Max. 5.25 0.1 Unit V V -2- ILX734LA Electrooptical Characteristics (Note 1) (Ta = 25C, VDD = 12V, fRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Item Red Sensitivity Green Blue Sensitivity nonuniformity Saturation output voltage Red Saturation exposure Green Blue Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Dynamic range Symbol RR RG RB PRNU VSAT SER SEG SEB VDRK DSNU IL IVDD TTE Zo VOS DR Min. 1.3 2.1 1.6 -- 2 0.74 0.46 0.58 -- -- -- -- 92 -- -- 1000 Typ. 2.0 3.2 2.5 6 3.2 1.6 1 1.28 0.3 1.5 0.02 26 95 250 6.5 10670 Max. 2.7 4.3 3.4 20 -- -- -- -- 2.2 5.5 -- 50 -- -- -- -- mV mV % mA % V -- Note 6 Note 6 Note 7 -- -- -- Note 8 Note 9 lx * s Note 5 % V Note 3 Note 4 V/(lx * s) Note 2 Unit Remarks Notes) 1. In accordance with the given electrooptical characteristics, the black level is defined as the average value of D2, D3 to D12. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT-G = 500mV (Typ.) (VMAX - VMIN)/2 PRNU = x 100 [%] VAVE Where the 10500 pixels are divided into blocks of 100. The maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4. Use below the minimum value of the saturation output voltage. 5. Saturation exposure is defined as follows. SE = VSAT/R Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB. 6. Optical signal accumulated time int stands at 11ms. 7. VOUT-G = 500mV (Typ.) VOUT 8. Vos is defined as indicated bellow. VOUT indicates VOUT-R, VOUT-G, and VOUT-B. 9. Dynamic range is defined as follows. DR = VSAT/VDRK When the optical signal accumulated time is shorter, the dynamic range gets wider because the optical signal accumulated time is in proportion to the dark voltage. -3- , , VOS GND Clock Timing Chart 1 ROG 2 3 4 10583 5 0 1 LH 5 0 2 5 0 RS 5 D1 D2 D3 D13 D14 D15 D61 D62 D63 S1 S10500 S64 S71 D72 D73 D78 D79 VOUT Optical black (49 pixels) Dummy signal (63 pixels) 1-line output period (10583 pixels) Note) The transfer pulses (1, 2, LH) must have more than 10583 cycles. VOUT indicates VOUT-R, VOUT-G, VOUT-B. , D83 -4- 0 1 ILX734LA ILX734LA Clock Timing Chart 2 t4 t5 ROG t2 t6 1 t1 t3 t7 2 Clock Timing Chart 3 t7 1 LH t6 2 t10 t9 RS t13 t11 t8 , , , t12 VOUT -5- Clock Timing Chart 4 (Shutter Operation) ROG 2 3 4 10583 5 0 1 LH 5 0 2 5 0 RS 5 -6- 0 SHUT Integration time Note) Shutter pulse must not be low level during from 2 to 10583 of 1. Integration time can be controlled by changing the timing SHUT fall. 1 ILX734LA ILX734LA Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise time/2 pulse fall time 1 pulse fall time/2 pulse rise time RS pulse high level period RS, LH pulse timing RS pulse rise time RS pulse fall time Signal output delay time Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 Min. 50 1200 1200 0 0 0 0 45 45 0 0 -- -- Typ. 100 3000 3000 5 5 20 20 2501 2501 10 10 10 10 Max. -- -- -- 10 10 60 60 -- -- 30 30 -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns 1 These timing data are the recommended condition under fRS = 1MHz. -7- Application Circuit1 5.1k VOUT-B IC1 2 Tr1 100 100 5.1k 2 SHUT-B ROG-B ROG-G VOUT-G Tr1 56 54 2 NC NC 2 NC VDD VOUT-B VDD ROG-B SHUT-B ROG-G NC 28 NC VOUT-G 55 53 52 51 50 35 34 33 32 31 30 29 RS LH GND 1 SHUT-R 1 SHUT-G ROG-R GND NC NC VOUT-R GND 1 2 3 4 7 23 5 6 22 24 25 26 27 -8- 100 100 2 Tr1 VOUT-R 5.1k RS LH 12V 0.1F 47F/ 100 16V IC1 SHUT-R 1 SHUT-G ROG-R IC1: 74AC04 Tr1: 2SC2785 1 Data rate fRS = 1MHz. In the case of fRS = 5MHz, 3 pieces of 74AC04 are recommended to use for 1 and 2 driver. ILX734LA Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. NC ILX734LA Example of Representative Characteristics (VDD = 12V, Ta = 25C) Spectral sensitivity characteristics (Standard characteristics) 1 0.8 Relative sensitivity 0.6 0.4 0.2 0 400 450 500 550 Wavelength [nm] 600 650 700 Dark signal output temperature characteristics (Standard characteristics) Integration time output voltage characteristics (Standard characteristics) 10 5 Output voltage rate Output voltage rate 0 10 20 30 40 50 60 1 1 0.5 0.5 0.1 0.1 1 5 int - Integration time [ms] 10 Ta - Ambient temperature [C] Offset level vs. VDD characteristics (Standard characteristics) 12 Ta = 25C 10 Vos - Offset level [V] Vos - Offset level [V] Offset level vs. temperature characteristics (Standard characteristics) 12 10 8 8 6 6 Vos Ta -0.5mV/C 4 Vos VDD 4 0.3 2 2 0 11.4 12.0 VDD [V] 12.6 0 0 10 20 30 40 50 60 Ta - Ambient temperature [C] -9- ILX734LA Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Cer-DIP Packages The following points should be observed when handling and installing cer-DIP packages. a) Remain within the following limits when applying static load to the ceramic portion of the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Upper ceramic layer 39N 29N 29N 0.9Nm , , , , , , , Lower ceramic layer (1) Low-melting glass (2) (3) (4) b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the glass to crack: because the upper and lower ceramic layers are shielded by low-melting glass, (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as tweezers. (5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. - 10 - ILX734LA 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. - 11 - Package Outline Unit: mm 56Pin DIP ( 400mil ) 113.0 1.0 2.0 A 43 42 29 10.0 1.0 5.0 0.8 56 H 14 110.0 A' 3.0 15 28 10.16 No.1 Pixel (Green) 8.8 V 0 to 9 15.0 0.8 84.0 ( 8m X 10500 Pixels ) 7.0 (AT STAND OFF) 3.0 5.0 97.0 ~ A' ~ 4.0 0.5 1. The point "A" of the package is the horizontal reference. The two points "A'" of the package are the vertical reference. 2. The height from the bottom "B" to the effective image area is 2.4 0.30mm. 3. The thickness of the cover glass is 0.8mm, and the refractive index is 1.5. 4. The notch of the package must not be used for reference of fixing. PACKAGE STRUCTURE PACKAGE MATERIAL Cer-DIP LEAD TREATMENT TIN PLATING LEAD MATERIAL 42ALLOY PACKAGE MASS 13.5g ILX734LA DRAWING NUMBER LS-E4(E) 4.4 0.5 - 12 - 29.21 29.21 0.46 1.27 3.6 0.25 ~ B 1 |
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